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IPC-T-50M (PDF) Single User
Terms and Definitions for Interconnecting and Packaging Electronic Circuits
Englisch. 123 pages. Stand:05/2015. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision M contains over 220 new or revised terms, including new terminology for conformal coatings, potting and encapsulation processes, stencil design, statistical process control, and flexible printed board technology. Also includes commonly used industry acronyms.
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IPC-T-50N (Hardcopy)
Terms and Definitions for Interconnecting and Packaging Electronic Circuits
Englisch. 92 pages. Stand: 11/2021
IPC-T-50N document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing English as a second language could understand the subtleties of the meaning. IPC-T-50N contains over 550 new or revised terms, including new terminology for via structures, surface mount device types, solder bumps, solder alloys, soldering, dewetting, board fabrication processes and testing.
IPC-T-50N (PDF) Single User
Terms and Definitions for Interconnecting and Packaging Electronic Circuits
nglisch. 92 pages. Stand: 11/2021. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
IPC-T-50N document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing English as a second language could understand the subtleties of the meaning. IPC-T-50N contains over 550 new or revised terms, including new terminology for via structures, surface mount device types, solder bumps, solder alloys, soldering, dewetting, board fabrication processes and testing.
IPC-TF-870 (PDF) Single User
Qualification and Performance of Polymer Thick Film Printed Boards
Englisch. 59 pages. Stand: November 1989. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Covers the materials, qualification, certification and performance requirements for multilayer polymer thick film (PTF) printed, extrusion deposited, or otherwise applied conductor, insulator and through-hole technology. This specification may also b e used for procurement of single and double-sided boards. 59 pages.
IPC-TM-650 (Hardcopy)
Test Methods Manual
Englisch.
Contains over 150 industry approved test techniques and procedures for chemical, mechanical, electrical, and environmental tests on all forms of printed boards and connectors. Updating (subscription) services are available for this manual.
IPC-TP-1113 (PDF) Single User
Circuit Board Ionic Cleanliness Measurement: What Does it Tell Us?
Englisch. 8 pages. Stand: 1994. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
A Technical Paper by Dr. Jack Brous discussing ionic cleanliness measurement, testing methods and cleanliness standards in relation to product reliability. Also includes a brief discussion of no-clean fluxes. 8 pages.
IPC-TP-1114 (PDF) Single User
The Layman's Guide to Qualifying a Process to J-STD-001B
Englisch. 13 pages. Stand: Januar 1998, Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Electronics manufacturers are faced with the difficult task of proving that a candidate manufacturing process can produce acceptable hardware, either to the customer of the product, or for internal quality control. Users have to determine many of the process qualification steps on their own. This document leads you through the task of qualifying a candidate process to J-STD-001B.
IPC-TP-1114 (PDF) Single User
The Layman's Guide to Qualifying a Process to J-STD-001B
Englisch. 13 pages. Stand: Januar 1998. Keine Druckberechtigung, DRM-geschützt,!!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Electronics manufacturers are faced with the difficult task of proving that a candidate manufacturing process can produce acceptable hardware, either to the customer of the product, or for internal quality control. Users have to determine many of the process qualification steps on their own. This document leads you through the task of qualifying a candidate process to J-STD-001B.
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IPC-TR-465-3 (PDF) Single User
Evaluation of Steam Aging on Alternative Finishes, Phase 11A
Englisch. 15 pages. Stand: Juli 1996. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Details the results of a two-year study to determine the effect of steam aging exposure on components. A variety of solderable finishes were used. A small production simulation utilized preconditioned and as-received samples and tested a total of 2,0 00 joints. 15 pages.
IPC-TR-486 (PDF) Single User
Report on Round Robin Study to Correlate IST & Microsectioning Evaluations for Detecting the Presence of Inner-Layer Separation
Englisch. 51 pages. Stand: Juli 2001. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This technical report provides full detail of the round robin study charged with assessing the use of Interconnect Stress Test (IST) as a test for incoming inspection in lieu of Thermal Stress in the detection of innerlayer separations in plated-thro ugh holes. Includes background on the Post Separation Task Group, test results, round robin test plan, conclusions and test methods used. 51 pages.
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