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PSA Assembly Guidelines for Single- & Double-Sided Flexible Printed Circuits

Englisch. 28 pages. Stand:2014 . Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)

This document provides the designer/user with guideline information related to the use of pressure sensitive adhesives (PSAs) for fabrication and assembly of flexible, rigid or rigid-flex printed boards, membrane switches and component attachments. It also provides information on adhesive types available, their inherent strengths, also provides information on adhesive types available, their inherent strengths, weaknesses, limitations and correct processes needed for creating proper assemblies and bare printed boards.

Handbook and Guide to Supplement J-STD-001

English. 160 pages. Released January 2021.

The IPC-HDBK-001H is a companion document to J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies providing guidance and supporting information for the requirements found in the standard. IPC-HDBK-001H is structured to map paragraph-to-paragraph with the standard, it includes the "how-to" and "why" behind many of the criteria in an easy-to-use reference handbook

Handbook and Guide to IPC-D-620 & IPC/WHMA-A-620

nglisch, Seiten 236, Stand: 2018. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)

IPC-HDBK-620 is a companion reference to IPC-D-620 ‘‘Design and Critical Process Requirements for Cable and Wiring Harnesses’’ and IPC/WHMA-A-620 ‘‘Requirements and Acceptance for Cable and Wire Harness Assemblies” and provides supporting information and technical rationale for requirements in those standards. This guidance document is highly recommended for anyone who wants to learn the “how” and “why” behind the requirements and is a must-have for process and manufacturing engineers working with cable and harness processes.

Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures

Englisch. Stand: Juni 2014, 168 Seiten, Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)

This standard is the companion document to IPC-A-630. IPC-HDBK-630 is an in-depth guideline to the design, manufacture, inspection and testing of the high level assembly, or "box" that encloses electronics assemblies. This document was written to help designers, manufacturers and end users of electronic enclosures of electrical and electronic equipment understand the industry's best practices to meet requirements + ensuring the reliability and function of the end-item assembly for its intended design life.
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Handbook for Press-fit Standard for Automotive Requirements and other High-Reliability Applications

Englisch. Stand: April 2022, 40 Seiten

PC-HDBK-9798 provides guidelines and supporting information for manufacturing electronic assemblies using compliant press-fit technology. The intent is to explain the ‘‘how-to’’ and ‘‘why’’ information, and fundamentals for these processes. This handbook is supporting the IPC-9797 standard.

Specification for Multilayer Hybrid Circuits

Englisch. 66 pages. Stand: Januar 1987. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)

Covers the qualification and performance requirements of multilayer circuits used in hybrid packaging. These circuits consist of three or more layers of conductor patterns separated from each other by insulating materials and interconnected by a cont inuous metallic interlayer connection. The substrate may include passive elements. 66 pages.
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