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IPC-6015 (PDF) Single User
Qualification & Performance Specification for Organic Multichip Module Mounting and Interconnecting Structures
Englisch. 78 Seiten. Stand: Februar 1998. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This specification establishes the specific requirements for organic mounting structures used to interconnect chip components, which in combination form the completed functional organic single-chip module (SCM-L) or organic multichip module (MCM-L) a ssembly and the quality and reliability assurance requirements that must be met for their acquisition. For use with IPC-6011. 78 pages.
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IPC-6017 (PDF) Single User
Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices
Englisch. 10 Seiten. Stand März 2009.. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This new standard supplements existing IPC-6010 series specifications with qualification and performance requirements for in-process and finished printed boards containing embedded passive circuitry (distributive capacitve planes and capacitive or re sistive components). 10 pages. Released March 2009.
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IPC-6017A (Hardcopy)
Qualification and Performance Specification for Printed Boards Containing Embedded Active and Passive Circuitry
Englisch. 32 Seiten. Stand: August 2021.
The IPC-6017A standard defines the electrical, mechanical, and environmental requirements specific to embedded passive and active circuitry in printed boards. These requirements are in addition to the applicable requirements of other performance specification(s) (e.g., J-STD-001).
IPC-6017A (PDF) Single User
Qualification and Performance Specification for Printed Boards Containing Embedded Active and Passive Circuitry
Englisch. 32 Seiten. Stand August 2021. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
The IPC-6017A standard defines the electrical, mechanical, and environmental requirements specific to embedded passive and active circuitry in printed boards. These requirements are in addition to the applicable requirements of other performance specification(s) (e.g., J-STD-001).
IPC-6018C (Hardcopy)
Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
Englisch. 64 pages. Stand: 2016
This specification covers qualification and performance of high frequency (microwave) boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements. Revision C incorporates many new requirements in areas such as HASL coatings, alternative surface finishes, edge plating, marking, microvia capture and target lands, copper cap plating of filled holes, copper filled microvias, PTFE smear and dielectric removal. For use with IPC-6011. Supersedes IPC-6018B and IPC-6016.
IPC-6018C (PDF) Single User
Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
Englisch. 64 Seiten. Stand:2016. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This specification covers qualification and performance of high frequency (microwave) boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements. Revision C incorporates many new requirements in areas such as HASL coatings, alternative surface finishes, edge plating, marking, microvia capture and target lands, copper cap plating of filled holes, copper filled microvias, PTFE smear and dielectric removal. For use with IPC-6011. Supersedes IPC-6018B and IPC-6016.
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IPC-6018D (Hardcopy)
Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
Englisch. 65 Seiten. Stand: 2022
The IPC-6018D standard covers qualification and performance of high frequency (microwave) boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements. IPC-6018D incorporates many new requirements in areas such as back-drilled holes, alternative surface finishes, pad/land anomalies, microvia capture and target lands, copper cap plating of filled holes, copper filled microvias, plating overhang/slivers and dielectric removal. For use with IPC-6011.
IPC-6018D (PDF) Single User
Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
Englisch. 65 Seiten. Stand: 2022. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
The IPC-6018D standard covers qualification and performance of high frequency (microwave) boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements. IPC-6018D incorporates many new requirements in areas such as back-drilled holes, alternative surface finishes, pad/land anomalies, microvia capture and target lands, copper cap plating of filled holes, copper filled microvias, plating overhang/slivers and dielectric removal. For use with IPC-6011.
IPC-6018DS (Hardcopy)
IPC-6018 - Revision D - Addendum - Space and Military
Englisch. 20 Seiten. Stand: 2022
The IPC-6018DS addendum supplements or replaces specifically identified requirements of IPC-6018D, for high frequency (microwave) printed boards that must survive the vibration, ground testing and thermal cyclic environments of space and military avionics. The IPC-6018DS addendum incorporates new requirements in areas such as copper wrap plating, dewetting, pad/land anomalies, copper cap plating of filled holes, copper filled microvias and therma shock. For use with IPC-6011 and IPC-6018. Supersedes IPC-6018CS.
IPC-6018DS (PDF) Single User
IPC-6018 - Revision D - Addendum - Space and Military
Englisch. 20 Seiten. Stand: 2022.
The IPC-6018DS addendum supplements or replaces specifically identified requirements of IPC-6018D, for high frequency (microwave) printed boards that must survive the vibration, ground testing and thermal cyclic environments of space and military avionics. The IPC-6018DS addendum incorporates new requirements in areas such as copper wrap plating, dewetting, pad/land anomalies, copper cap plating of filled holes, copper filled microvias and therma shock. For use with IPC-6011 and IPC-6018. Supersedes IPC-6018CS.
