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IPC-6012F (PDF) Single User
Qualification and Performance Specification for Rigid Printed Boards
English. 80 pages. Released: September 2023.
IPC-6012F, covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements. IPC-6012 revision F incorporates many new and expanded requirements in areas such as printed board cavities, copper wrap plating, “intermediate” target lands, solderability testing, dewetting, microsection evaluation, internal plated layers, dielectric spacing and reliability issues with microvia structures. IPC 6012F is used with IPC-6011 and supersedes IPC-6012E.
IPC-6012F-Redline (PDF) Single User
Qualification and Performance Specification for Rigid Printed Boards - Redline
Englisch. 133 Seiten. Stand: Januar 2023
IPC-6012F Redline document shows the changes from IPC-6012E to IPC-6012F in a side-by-side comparison of the two documents. The IPC-6012F redline is available in both electronic and hardcopy format.
IPC-6012FS (Hardcopy)
Space and Military Avionics Applications Addendum to IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards
English. 20 pages. Published Date: 02/01/2024
This Addendum supplements or replaces specifically identified requirements of IPC-6012D, Revision D, for rigid printed boards that must survive the vibration, ground testing and thermal cyclic environments of space and military avionics.
IPC-6012FS (PDF) Single User
Space and Military Avionics Applications Addendum to IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards
English. 20 Pages. Published Date: 02/01/2024
The IPC-6012FS space addendum provides exceptions to IPC Performance Class 3 requirements of the IPC-6012F for use in space and military avionics product. Exceptions include changes to acceptance criteria and/or sample size and test frequency for production lot acceptance testing. The IPC-6012FS covers requirements for rigid printed boards to survive vibration, extreme thermal cycling and ground testing associated with space travel environment. Supersedes IPC-6012ES.
IPC-6013D (Hardcopy)
Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
Englisch. 80 pages. Released 2017
The IPC-6013D covers qualification and performance requirements for flexible printed boards designed to IPC-2221 and IPC-2223. The flexible printed board may be single-sided, double-sided, multilayer or rigid-flex multilayer. All of these constructions may include stiffeners, PTHs, microvias, and blind/buried vias. IPC-6013D incorporates new and updated requirements for final finishes, rigid-to-flex transition zones, deformation anomalies including wrinkles, creases and soda strawing, marking, registration (annular ring), conductor thickness reductions, dielectric removal in holes, resin smear, copper filled microvias and selective (button) hole plating.
IPC-6013D (PDF) Single User
Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
Englisch. 80 Seiten. Released 2017. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
The IPC-6013D covers qualification and performance requirements for flexible printed boards designed to IPC-2221 and IPC-2223. The flexible printed board may be single-sided, double-sided, multilayer or rigid-flex multilayer. All of these constructions may include stiffeners, PTHs, microvias, and blind/buried vias. IPC-6013D incorporates new and updated requirements for final finishes, rigid-to-flex transition zones, deformation anomalies including wrinkles, creases and soda strawing, marking, registration (annular ring), conductor thickness reductions, dielectric removal in holes, resin smear, copper filled microvias and selective (button) hole plating.
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IPC-6013D-AM1 (PDF) Single User
Qualification and Performance Specification for Flexible and Rigid-Flexible Printed Boards
Englisch. 8 Seiten. Released 2018. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
IPC-6013D-AM1 is an amendment makes changes to the existing acceptance criteria for copper wrap plating measurements as defined by IPC-6013D. IPC-6013D-AM1 is an amendment which implements a dual criterion for Class 3 copper wrap plating, based on design effectivity (before and after July 01, 2018), so as not to impose onto legacy designs any additional qualification activity associated with adopting acceptance requirements proven on newer designs. IPC-6103D-AM1 is not applicable to legacy product that will remain subject to IPC-6013D copper wrap plating requirements
IPC-6013D-AM1 Hardcopy
Qualification and Performance Specification for Flexible and Rigid-Flexible Printed Boards
Englisch. 8 Seiten. Released 2018
IPC-6013D-AM1 is an amendment makes changes to the existing acceptance criteria for copper wrap plating measurements as defined by IPC-6013D. IPC-6013D-AM1 is an amendment which implements a dual criterion for Class 3 copper wrap plating, based on design effectivity (before and after July 01, 2018), so as not to impose onto legacy designs any additional qualification activity associated with adopting acceptance requirements proven on newer designs. IPC-6103D-AM1 is not applicable to legacy product that will remain subject to IPC-6013D copper wrap plating requirements
IPC-6013E (Hardcopy)
Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
Englisch. 84 pages. Released 2021
IPC-6013E standard covers qualification and performance requirements for flexible printed boards designed to IPC-2221 and IPC-2223. The flexible printed board may be single-sided, double-sided, multilayer or rigid-flex multilayer. All of these constructions may include stiffeners, PTHs, microvias, and blind/buried vias. The IPC-6013E standard incorporates new and updated requirements for final finishes, rigid-to-flex transition zones, foreign inclusions, surface mount land anomalies, plated internal layers, dielectric removal as a function of wicking and etchback, copper filled via structures microvia structures.
IPC-6013E (PDF) Single User
Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
Englisch. 84 Seiten. Released 2021. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
IPC-6013E standard covers qualification and performance requirements for flexible printed boards designed to IPC-2221 and IPC-2223. The flexible printed board may be single-sided, double-sided, multilayer or rigid-flex multilayer. All of these constructions may include stiffeners, PTHs, microvias, and blind/buried vias. The IPC-6013E standard incorporates new and updated requirements for final finishes, rigid-to-flex transition zones, foreign inclusions, surface mount land anomalies, plated internal layers, dielectric removal as a function of wicking and etchback, copper filled via structures microvia structures.
